Something to check ahead to: Intel posted research that is several to this year’s International Electron Devices Meeting (IEDM), highlighting their plans to pursue new 2D transistor materials and 3D packaging solutions. The new information backs CEO Pat Gelsinger’s previous statements regarding Intel’s upcoming microarchitecture design innovations. According to Intel’s Gary Patton, the new advancements will keep Moore’s Law alive and well for the future that is foreseeable.
Earlier this present year, Nvidia’s Jensen Huang declared Moore’s Law dead (again) within a 4000-series launch Q&A program. The forecast echoed statements that are similar by Huang during the 2017 Beijing GPU Technology Conference. And much like those times before, Intel isn’t buying what Nvidia’s leather leader is selling.
The company’s 2023 IEDM research submissions highlight processes that are several products, and technologies that may assist the semiconductor monster to guide their particular past statements on delivering chiplet-based trillion transistor processors by 2030.
Intel’s brand-new transistor and packaging scientific studies are mostly focused on advancing CPU performance and effectiveness, shutting the exact distance between old-fashioned single-die processors and brand-new designs that are chiplet-based. Some of the concepts presented in the submitted materials include greatly reducing gaps between chiplets to improve performance, transistors capable of retaining their state even after losing power, and new memory that is stackable.
Gary Patton, Intel’s vice-president and basic supervisor of Components Research (CR) and Design Enablement, stated that “seventy-five many years because the innovation associated with the transistor, development driving Moore’s Law will continue to deal with the planet’s exponentially demand that is increasing computing. At IEDM 2022, Intel is showcasing both the forward-thinking and research that is concrete necessary to break through present and future obstacles, deliver for this insatiable need, and keep Moore’s Law live and really for a long time in the future.”
The CR team’s studies have identified processes that are new materials critical to driving the company closer to their trillion-transistor milestone. The company’s latest hybrid bonding research shows a 10x improvement over the previous year’s presentation. Other research showcased by Intel’s submissions includes designs using materials that are novel thicknesses maybe not surpassing three atoms, memory that may be put vertically above transistors, as well as a higher knowledge of user interface problems that will adversely impact quantum information storage space and retrieval.
Intel’s Components Research Group functions as the business’s inner frontrunner for brand new and technology development that is groundbreaking. CR engineers invent and develop new materials and methods that support semiconductor manufacturers in the ongoing battle to shrink technology to the scale that is atomic. The team is in charge of Intel’s extreme ultraviolet lithography (EUV) technology, which was vital to being able to carry on shrinking node sizes while increasing general semiconductor abilities. The team’s work and timelines are usually five to ten years in front of commercially technologies that are available
