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In a nutshell: Western Digital plans to begin mass-producing 162-layer BiCS6 3D NAND, which is probably going for use in PCIe 5 SSDs by the top of this yr. The firm can be engaged on NAND with 200+ layers meant for datacenter storage, PLC, and methods to bond collectively a number of 3D NAND wafers to extend the variety of layers.
Western Digital, along with accomplice Kioxia, simply gave us a have a look at their roadmap for the following few years of NAND growth. The firm plans to introduce its sixth era BiCS quickly, which is able to characteristic 162 layers in TLC and QLC configurations.
While which may not sound so spectacular contemplating opponents like Micron have had 176-layer NAND for some time now, WD claims they’ll shrink the reminiscence cell dimension by utilizing a brand new materials, leading to smaller die sizes.
The firm hopes that this can enable them to construct cheaper storage gadgets that carry out simply as effectively. Mass manufacturing of BiCS6 3D NAND is scheduled to begin in late 2022, with WD planning to make use of these chips in merchandise starting from low-cost USB drives to PCIe 5.0 SSDs.
WD additionally talked about their upcoming BiCS+ reminiscence with over 200 layers, which is ready to reach by 2024. It will characteristic 55 % extra bits per wafer, 60 % greater switch pace, and a 15 % greater write pace in comparison with BiCS6.
It’s price noting that BiCS+ is supposed for use solely in datacenter SSDs, as the corporate plans to supply a unique class of 2xx-layer NAND for shopper storage, dubbed BiCS-Y.
Western Digital moreover shared that they’re engaged on a number of applied sciences to enhance density and capability, together with PLC, and that they are planning to construct NAND with 500+ layers throughout the subsequent decade.
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