The massive image: Intel CEO Pat Gelsinger just lately met with a number of high-ranking Samsung executives to debate a possible collaboration. The talks come amid the continuing world semiconductor scarcity and at a time when competitors with rivals like Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest contract chipmaker, is heating up.
According to a report from The Korea Herald, Gelsinger flew to Korea after attending the 2022 World Economic Forum in Switzerland to fulfill with Samsung Vice Chairman Lee Jae-yong, co-CEO Kyung Kye-hyun, cellular division chief Roh Tae-moon and others.
Reports declare the 2 sides mentioned methods to higher cooperate and “exchanged opinions on next-generation reminiscence chips, fabless system chips [and] foundry chips in addition to these for PCs and cellular gadgets.”
Intel has been ramping up chip manufacturing investments in latest reminiscence. In January, the corporate dedicated $20 billion to construct a brand new facility in Ohio and shelled out one other $5.4 billion the next month to buy Israeli specialty chipmaker Tower Semiconductor.
It would appear that Intel is taking part in on each side of the fence. Back in November, it was rumored that Intel had requested TSMC to make use of its 3nm chip tech for its upcoming Meteor Lake processors. Last month, Taiwanese media stated Gelsinger met with high TSMC executives to debate securing extra sub-7nm manufacturing capability.
Samsung, in the meantime, stated final month that it expects business manufacturing of 3nm chips to start out quickly. Another rumor from February instructed Samsung was experiencing yield points on superior nodes, and that at the least one buyer had already been misplaced over the matter.
Image credit score: Laura Ockel